JCID Chip Underfill UF6008 (5ML)

• The underfill will diffuse to the bottom of the chip evenly within 1-3 minutes • Cure within 1 min/under 150°C or within 5 min/under 100°C automatically • Being softened under high temperature, simplify the process of rework • Superior adhesiveness, improve the anti-dropping resistance, rework is reduced, prolong the service life of the device