MECHANIC Heat-Mini IC Glue Removal Station

Features: -Intelligent one-touch heating utilises a professional temperature ramping algorithm with factory-calibrated temperature control curves, effectively preventing thermal stress damage to chips for greater peace of mind -Supports continuously adjustable temperatures from 160°C to 250°C with stable temperature control, meeting the requirements for adhesive and solder removal on all types of chips -No need for a heat gun or soldering iron. Once the desoldering station is heated to the set temperature, simply wipe with a Repair Master brush to easily remove adhesive -Concealed telescopic screw design, durable and easy to clean, with flexible extension and clamping -Fully concealed screw structure prevents debris from entering, ensuring no jamming or dirt accumulation for a longer service life -18×21mm micro-work area precisely focuses heat on the chip body, minimising temperature fluctuations to ensure the adhesive removal process does not burn the board or damage the pads -Exceptional versatility with an extremely wide range of compatibility, supporting 99% of chip, hard drive and CPU adhesive and solder removal tasks on the market – a single machine with multiple uses