XZZ-Middle Board Layer Testing JIG – XZZ 16 Series (4 in 1)

Features: -XZZ 16 delamination test frame, Resolve issues such as repeated lamination and delamination during motherboard repair, as well as testing difficulties, making motherboard testing simple and fast -Precise positioning/Unobstructed design/Integrated design/Four in one/High-density metal/Human body mechanics design -4-in-1 set is complete: Adaptation of four models, many years of experience in the design of test rack products, so that you have a comfortable experience of testing motherboards -Probe corresponds one-to-one with solder pad: Dual-head probes accurately aligned with small holes, effectively improving contact performance, using a fixed pressure button compression, the motherboard does not buckle, the test value is more accurate -Function board design without middle frame testing: During the repair process, the middle frame may also face malfunctions. We have selected a functional board for you, which is compatible with testing without the middle frame -Solder-free test function: Can test power on, display, touch, camera, flash, earpiece, speaker, WiFi, facial recognition, etc. -Custom gold-plated spring probes: Adopt imported pure copper gold-plated probe, its conductivity can be better between the motherboard for accurate connection -Spring-loaded buckle: Quick rebound, timely feedback, no buckling of the motherboard, more accurate testing -Non-slip foot mats: Prevents slipping during testing due to external forces, etc